Yixing Hengyuan Ceramic Technology Co., Ltd.
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Cordierite has low thermal expansion and high thermal shock resistance, making it suitable for use as a refractory material. Cordierite can also be used as a material for electronic devices due to its excellent dielectric properties.
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Item
| Test Condition | Unit&Symbol | Cordierite Ceramics |
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The main chemical ingredient
| MgO, Al2O3,SiO2 | ||
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Bulk Density
| gm/cc | 2.6 | |
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Maximum Use Temperature
| 1400℃ | ||
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Hardness
| HV | 800 | |
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Bending Strength
| 20℃ | Kgf/cm2 | 900 |
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Compressive Strength
| 20℃ | Kgf/cm2 | 3500 |
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Fracture Toughness
| K(I c) | Mpa m1/2 | - |
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Thermal expansion
| 1X 10-6/℃ | ≤2.0 | |
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Thermal conductivity
| 25℃-30℃ | W/m.k | 1.3 |
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Thermal Shock Resistance
| Tc | ℃ | 250 |
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Dielectricity constant
| 1MHz.25℃ | 6 | |
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Dielectric strength
| ac-kV/mm (ac V/mil) | 10 | |
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Volume Resistivity
| 20℃ | ohm-cm | > 1012 |
